Gel-Pak Tack Levels

Gel-Pak produces gel-based carriers and trays for handling delicate semiconductor components, MEMS devices, optics, and other small parts. The gel provides controlled retention through surface adhesion.

Retention Chart

Gel Elastomer

ESD Gel

Vertec Elastomer

ESD Vertec Elastomer

Product Types

• AD — Adhesive Die (individual cavities)
• BD — Bare Die (open gel surface)
• CD — Chip Die
• VR — Vacuum Release
• PF — Peel Film
• WF — Wafer Film
• DGL — Gel-covered lid

Selection Guide

• Heavier/larger components → lower tack level
• Thinner/smaller components → higher tack level
• Rough surfaces → lower tack (more mechanical grip)
• Smooth/polished surfaces → higher tack needed
• ESD-sensitive components → use ER or EH series

Tips

• Components should release cleanly with tweezers or vacuum pickup
• If parts fly off during transport → increase tack level
• If parts are hard to pick up → decrease tack level
• Store gel trays covered to prevent dust contamination